Headwinds in U.S.-Taiwan Technology Policy – USTBC Panel at SEMICON 2026

Headwinds in U.S.-Taiwan Technology Policy

September 2, 2026

14:00-15:30
Room 505AB, 5F, TaiNEX 1

On September 2, 2026, the US-Taiwan Business Council will host a partner panel discussion at SEMICON Taiwan 2026. SEMICON is one of the premier venues for business and technology leaders, researchers, and industry analysts from across the microelectronics supply chain.

The USTBC panel discussion, moderated by President Rupert Hammond-Chambers, examines policy challenges and opportunities in the bilateral technology relationship between the United States and Taiwan.

13:30 – 14:00     Registration/ Check-In

14:15 – 15:25     Panel Discussion (Additional Panelists TBC)

Moderator: Rupert Hammond-Chambers, President, US-Taiwan Business Council
Speaker: Stephen Braim, Vice President, IBM
Speaker: Patrick Wilson, Founding Principal, Semiconductor & Innovation Group

15:25 – 15:30     Closing Comments

The US-Taiwan Business Council thanks our panelists and attending members and friends for this opportunity to discuss such an interesting and pertinent topic. We were excited for the opportunity to work with SEMI to arrange a partner event at SEMICON Taiwan 2026, and look forward to continuing this important discussion.