Headwinds in U.S.-Taiwan Technology Policy – USTBC Panel at SEMICON 2026

Headwinds in U.S.-Taiwan Technology Policy

September 2, 2026

14:00-15:30
Room 505AB, 5F, TaiNEX 1

Panelists Speaking on the USTBC panel at SEMICON Taiwan 2026

On September 2, 2026, the US-Taiwan Business Council hosted a partner panel discussion at SEMICON Taiwan 2026. SEMICON is one of the premier venues for business and technology leaders, researchers, and industry analysts from across the microelectronics supply chain.

The USTBC panel discussion, moderated by President Rupert Hammond-Chambers, examined policy challenges and opportunities in the bilateral technology relationship between the United States and Taiwan.

13:30 – 14:00     Registration/ Check-In

14:15 – 15:25     Panel Discussion

Moderator: Rupert Hammond-Chambers, President, US-Taiwan Business Council
Speaker: Stephen Braim, Vice President, IBM
Speaker: Heidi Mah, Director, BowerGroupAsia
Speaker: Dan Nystedt, Vice President of Research, TriOrient Investments Ltd.
Commentator: Bill Frauenhofer, Executive Director, Semiconductor Innovation and Investment, U.S. Department of Commerce-National Institute of Science & Technology

15:25 – 15:30     Closing Comments

The US-Taiwan Business Council thanks our panelists and attending members and friends for this opportunity to discuss such an interesting and pertinent topic. We are excited for the opportunity to work with SEMI to arrange a partner event at SEMICON Taiwan 2026, and look forward to continuing this important discussion.

Mr. Bill Frauenhofer, Executive Director, Semiconductor Innovation and Investment, U.S. Department of Commerce-National Institute of Science & Technology